
1. Excellent electrical performance: low DCR DC internal resistance, high saturation current, strong energy storage capacity, high power conversion efficiency, stable voltage output under load.
2. Good shielding and anti-interference: The enclosed magnetic shielding structure has low magnetic leakage and EMI interference, and can be placed close to high-density chip patches. The whole machine is easy to pass electromagnetic compatibility testing.
3. Reliable temperature resistance welding: The working temperature range is -40 ℃~125 ℃, and it can withstand lead-free reflow soldering at 260 ℃ for a short time. The parameters do not show significant attenuation after high and low temperature cycling.
4. Compact, compliant, and durable: lightweight and compact patch packaging, suitable for laptops LED、 Automated installation of audio equipment; Lead free complies with RoHS environmental standards, with a stable structure and no abnormal noise.



| TYPE | A | B | C | D |
|---|---|---|---|---|
| GBF6028 | 6.0±0.2 | 3.0 | 2.0 | 3.0 |
| GBF7025 | 7.0±0.2 | 2.8 | 2.0 | 4.0 |
| GBF7032 | 7.0±0.2 | 3.4 | 2.0 | 4.0 |
| GBF7045 | 7.0±0.2 | 4.8 | 2.0 | 4.0 |
| GBF7055 | 7.0±0.2 | 5.8 | 2.0 | 4.0 |
| GBF1045 | 10.1±0.3 | 4.8 | 3.0 | 6.0 |
| GBF1065 | 10.1±0.3 | 6.9 | 3.0 | 6.0 |
| GBF1255 | 12.5±0.3 | 5.9 | 3.0 | 8.6 |
| GBF1265 | 12.5±0.3 | 6.9 | 3.0 | 8.6 |
| GBF1275 | 12.5±0.3 | 7.9 | 3.0 | 8.6 |

