
1. Automation-Ready Design: Standardized flat-bottom surface supports high-speed SMT pick and-place, significantly improving production efficiency and consistency.
2.Compact & Shielded: Miniaturized packaging with closed magnetic path structure reduces EMI leakage and enables high-density PCB layouts.
3.High Performance: Delivers high saturation current, low DCR, and low core loss; optimized materials reduce heat generation under heavy loads.
4. Customizable & Certified: Extensive material library (MnZn, NiZn, Fe-Si-Al, amorphous) enables tailored inductance values (up to 20OmH+); holds IATF16949, RoHS, and REACH certifications.








| TYPE | A ±0.3 | B ±0.3 | C max | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| GCD30 | 3.00 | 3.50 | 1.30 | 1.00 | 1.30 | 0.90 | 1.30 | 3.50 |
| GCD31 | 3.00 | 3.50 | 1.80 | 1.00 | 1.30 | 0.90 | 1.30 | 3.50 |
| GCD32 | 3.00 | 3.50 | 2.40 | 1.00 | 1.30 | 0.90 | 1.30 | 3.50 |
| GCD42 | 4.00 | 4.50 | 2.30 | 1.50 | 1.80 | 1.20 | 1.80 | 4.50 |
| GCD43 | 4.00 | 4.50 | 3.50 | 1.50 | 1.80 | 1.20 | 1.80 | 4.50 |
| GCD51 | 5.20 | 5.80 | 2.30 | 1.50 | 2.70 | 1.20 | 2.70 | 5.80 |
| GCD52 | 5.20 | 5.80 | 2.80 | 2.00 | 2.40 | 1.80 | 2.40 | 5.80 |
| GCD53 | 5.20 | 5.80 | 3.80 | 1.80 | 2.70 | 1.20 | 2.70 | 5.80 |
| GCD54 | 5.20 | 5.80 | 4.80 | 1.50 | 2.60 | 1.40 | 2.60 | 5.80 |
| GCD73 | 7.00 | 7.80 | 3.80 | 2.50 | 3.00 | 2.00 | 3.00 | 7.50 |
| GCD75 | 7.00 | 7.80 | 5.20 | 2.50 | 3.00 | 2.00 | 3.00 | 7.50 |
| GCD104 | 9.00 | 10.0 | 4.20 | 3.20 | 3.75 | 2.50 | 3.75 | 9.50 |
| GCD105 | 9.00 | 10.0 | 5.80 | 3.20 | 3.75 | 2.50 | 3.75 | 9.50 |
| GCD106 | 9.00 | 10.0 | 7.50 | 3.20 | 3.75 | 2.50 | 3.75 | 9.50 |
| GCD108 | 9.00 | 10.0 | 8.50 | 3.20 | 3.75 | 2.50 | 3.75 | 9.50 |
