
1. Compact size: Supports multiple packages such as square and cylindrical, with metal pads at the bottom compatible with SMT (Surface Mount Technology) process, perfectly fitting the design requirements of high-density PCB boards.
2. Leadless design: As an SMD device, it connects directly to the circuit board through the bottom solder pad, reducing lead parasitic inductance and capacitance, thereby significantly enhancing high-frequency performance.
3. Magnetic ring coil assembly: With a high-permeability ferrite magnetic ring as the core, a copper coil is wound externally to efficiently achieve the mutual conversion between electric energy and magnetic energy.
1. Consumer electronics: small size + high-frequency characteristics + low cost, preferably used for charging and RF circuits
2. Automotive/Industrial: Automotive/Industrial-grade certification + High temperature resistance + High reliability, with emphasis on power supply and control modules
3. Communication equipment: high precision + low loss + anti-interference, compatible with 5G high-frequency signal processing
GTCSM0903C-120D

| A | B | C |
|---|---|---|
| 9.4 Max | 7.2 Max | 2.6 Max |