English
Inquiry
TDS DownloadProduct Introduction
Product Features of Chip Bead Inductor GTCSM1609C SERIES
1. Compact size: The bottom metal pads are compatible with SMT (Surface Mount Technology) process, perfectly fitting the design requirements of high-density PCB boards.
2. Leadless design: As an SMD device, it connects directly to the circuit board through the bottom solder pad, reducing lead parasitic inductance and capacitance, and significantly enhancing high-frequency performance.
3. Magnetic ring coil assembly: With a high-permeability ferrite magnetic ring as the core, an external copper wire coil is wound around it, efficiently facilitating the mutual conversion between electrical energy and magnetic energy.
Application of Chip Magnetic Ring Inductors GTCSM1609C SERIES
1. Consumer electronics: small size + high-frequency characteristics + low cost, preferably used for charging and RF circuits
2. Automotive/Industrial: Automotive/Industrial Grade Certification + High Temperature Resistance + High Reliability, with a focus on Power Supply and Control Modules
3. Communication equipment: high precision + low loss + anti-interference, compatible with 5G high-frequency signal processing
Third: Naming convention for chip magnetic ring inductors
GTCSM1609C-401NT
Product Specifications
| Part Number | Inductance 1-2=4-3 @10KHz/0.1V | DC Resistance 1-2=4-3 (mΩ) Max | Rated Current (A) Max | SRF (MHZ) | Insulation Resistance 80V/3S (MΩ) Min | Hi-Pot 1,2-4,3 (Vdc) 3mA/1S | Marking |
|---|---|---|---|---|---|---|---|
| GTCSM1609C-901DT | 0.9mH±35% | 60 | 2.0 | 3.0 | 10 | 500V | ● 901 |
| GTCSM1609C-122DT | 1.2mH±35% | 80 | 2.0 | 2.0 | 10 | 500V | ● 122 |
| GTCSM1609C-352DT | 3.5mH±35% | 180 | 2.0 | 0.5 | 10 | 500V | ● 352 |
| GTCSM1609C-602DT | 6.0mH±35% | 450 | 1.5 | 0.3 | 10 | 500V | ● 602 |
| GTCSM1609C-133DT | 13.2mH±35% | 850 | 0.8 | 0.2 | 10 | 500V | ● 133 |
Package size specifications of chip magnetic ring inductors
| A | B | C | D |
|---|---|---|---|
| 14.22 Max | 16.38 Max | 8.9 Max | 13.2±0.4 |
