
1. Compact size: Supports square packaging, with bottom metal pads compatible with SMT (Surface Mount Technology) process, perfectly fitting the design requirements of high-density PCB boards.
2. Leadless design: As an SMD device, it connects directly to the circuit board through the bottom solder pad, reducing lead parasitic inductance and capacitance, and significantly enhancing high-frequency performance.
3. Magnetic ring coil assembly: With a high-permeability ferrite magnetic ring as the core, a copper coil is wound externally, efficiently facilitating the mutual conversion between electrical energy and magnetic energy.
1. Consumer electronics: small size + high-frequency characteristics + low cost, preferably used for charging and RF circuits
2. Automotive/Industrial: Automotive/Industrial Grade Certification + High Temperature Resistance + High Reliability, with a focus on Power Supply and Control Modules
3. Communication equipment: high precision + low loss + anti-interference, compatible with 5G high-frequency signal processing
GTCSM0503-101YT

| A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|
| 6.0±0.3 | 3.3±0.3 | 3.3±0.3 | 5.0±0.3 | 1.3Typ | 3.1Typ | 0.4Typ | 5.4Typ |